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Energy Efficient 3-D CPU the new kid in the block
Desmon Shial
Nov. 21, 2011
A North Carolina State University team of computer engineers are all set to solve some problems involving the development of three-dimensional (3D) central processing units (CPUs). It will be the next bi thing after the cloud comnputing.
The project is funded by a $1.5 million research grant from Intel.
The concept lies around creating a 3D CPU chip stack to boost performance per unit of power by 15 percent to 25 percent.
Three-dimensional integrated chip sets are vertically integrated chips that are connected by vertical electronic connections that pass through silicon wafers. The conventional computer chips only operate in two dimensions. The target date for the prototype is 2014.
TECHNOLOGY ARTICLES
Energy Efficient 3-D CPU the new kid in the block
Desmon Shial
The conventional computer chips only operate in two dimensions. The target date for the prototype is 2014.
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